Taiwanese IC Packaging & Testing Industry, 3Q 2020
The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$ 4.4 billion in the second quarter of 2020 and registered over 4% sequentially growth and nearly 20% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019 and was mainly attributed to order transfer of IDMs (Integrated Device Manufacturers) due to city lockdowns worldwide. Despite the cooling demand in the consumer market, it is anticipated the industry will continue togrow in the third quarter of 2020 and throughout 2020. 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts will further bolster growth this year.
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2018 - 4Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2018 - 4Q 2020
Taiwanese IC Packaging Industry Shipment Value, 2Q 2018 - 4Q 2020
Taiwanese IC Testing Industry Shipment Value, 2Q 2018 - 4Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 2Q 2018 - 2Q 2020
Taiwanese IC Testing Industrys Shipment Value Rankings, 2Q 2018 - 2Q 2020
Taiwanese IC Testing Industry Shipment Value by Vendors Tier, 2Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2018 - 2Q 2020
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 2Q 2018 - 2Q 2020
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 2Q 2018 - 2Q 2020
Exchange Rate, 2Q 2018 - 2Q 2020
Research Scope & Definitions
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