Taiwanese IC Packaging & Testing Industry, 2Q 2019

This report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.4 billion in the first quarter of 2019, down both year-on-year and sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to have seen a modest pickup in shipmentsin the second quarter of 2019.

Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 3Q 2019
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 -3Q 2019
Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendors Tier, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors Tier, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value by Customers Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customers Origin, 2Q 2016 - 1Q 2019
Exchange Rate, 2Q 2016 - 4Q 2018
Research Scope & Definitions

Taiwanese Semiconductor Manufacturing Industry, 2Q 2019

The report finds that the Taiwanese semiconductor manufacturing industry, comprising mainly of foundry, DRAM, flash memory, and IDM sectors, continued to decline both sequentially and year-on-year in the first quarter

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Taiwanese IC Packaging & Testing Industry, 2Q 2019

This report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.4 billion in the first quarter of 2019, down both year-on-year and sequentially.

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Global Antistatic Packaging Material Market Report 2019 - Market Size, Share, Price, Trend and Forecast

The global market size of Antistatic Packaging Material is $XX million in 2018 with XX CAGR from 2014 to 2018, and it is expected to reach $XX million by the

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North America Antistatic Packaging Material Market Report (2014-2024) - Market Size, Share, Price, Trend and Forecast

Abstract:The North America Antistatic Packaging Material market size is $XX million USD in 2018 with XX CAGR from 2014 to 2018, and it is expected to reach $XX million USD

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