Taiwanese IC Packaging & Testing Industry, 1Q 2019

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.9 billion in the fourth quarter of 2018, up year-on-year but down sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to show a modest pickup in shipment growth in the second quarter of 2019.


Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 2Q 2019

Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 2Q 2019

Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 - 2Q 2019

Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 2Q 2019

Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 4Q 2018

Taiwanese IC Packaging Industry Shipment Value by Vendors Tier, 2Q 2016 - 4Q 2018

Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 4Q 2018

Taiwanese IC Testing Industry Shipment Value by Vendors Tier, 2Q 2016 - 4Q 2018

Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2016 - 4Q 2018

Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2016 - 4Q 2018

Taiwanese IC Testing Industry Shipment Value by Customers Origin, 2Q 2016 - 4Q 2018

Taiwanese IC Testing Industry Shipment Value Share by Customers Origin, 2Q 2016 - 4Q 2018

Exchange Rate, 2Q 2016 - 4Q 2018

Research Scope & Definitions

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