Recap and Outlook for The Taiwanese Semiconductor Industry, 2Q 2021 (pre-order)

Shipment value of the Taiwanese semiconductor industry reached US$28.72 billion in the first quarter of 2021, up by 3.7% sequentially and 30.9% year on year. This report discusses the key issues in major subsectors of the Taiwanese semiconductor industry including IC design, semiconductor manufacturing, and packaging and testing, which is also known as OSAT (Outsourced Semiconductor Assembly and Test); looks into the industrys development in the first quarter of 2021 to forecast its development in the second quarter of 2021 and onwards.
Table of Contents
1.Key Issues in Three Semicondcutor Subsectors
1.1 IC Design
1.1.1 Intensified Competition in the Smartphone IC Market as Ban on Huawei Continues
1.1.2 IC Vendors Raise Prices as Supply Fails to Meet Demand
1.2 Semiconductor Manufacturing
1.2.1 Low IC Capacity Growth Results in Crowding Out Effect
1.2.2 Governments Step in to Push Capacity aim Automotive IC Supply Crunch
1.3 OSAT
1.3.1 Wire Bonding Demand Surges as the Automotive IC Market Recovers
1.3.2 OSAT Companies Continues to Delay Shipments aim Material Shortage
2. Industry Outlook
2.1 IC Design
2.1.1 Smartphone IC Momentum Still Exists despite COVID-19 Outbreak in Regional Markets
2.1.2 Revenue Growth Hinges on Production Capacity; Covid-19 Outbreak to be the Biggest Source of Uncertainty
2.2 Semiconductor Manufacturing
2.2.1 Crowding Out Effect Affects End Product Shipments; Unexpected Events Worsen the Situation
2.2.2 Advanced Processes Gain Favor; Wafer Foundries Aggressively Expand Advanced IC Capacity
2.3 OSAT
2.3.1 Increased Capacity and Prices Drive Revenue Growth; Customer Relationships Come before Profits
2.3.2 Poor Covid-19 Prevention Measures for Migrating Workers Affects OSAT Companies’ Production Capacity and Supply
Appendix
List of Companies

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