Taiwanese Semiconductor Manufacturing Industry, 4Q 2019
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020
Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020
Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020
Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendors Business Type, 1Q 2017 - 3Q 2019
Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019
Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019
Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019
Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019
Taiwanese DRAM Industrys Shipment Value Ranking, 1Q 2017 - 3Q 2019
Taiwanese DRAM Industrys 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019
Taiwanese DRAM Industrys 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019
Exchange Rate, 1Q 2017 - 3Q 2019
Research Scope & Definitions
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