Development Highlights of Taiwans Semiconductor Industry, 2Q 2023 (pre-order)

The overall shipment value of Taiwans semiconductor industry in the first quarter of 2023 reached US$29.3 billion, representing a decline of 13.7% compared to 4Q 2022 and a decline of 22.4% compared to 1Q 2022. This report aims to analyze key development trends and issues in the IC design, semiconductor manufacturing, and packaging and testing industry sectors in the first quarter of 2023, as well as the development highlights of Taiwans semiconductor industry as a whole; examines the development of the semiconductor industry in the second quarter of 2023 and beyond.

1.Key Development Highlights
1.1 IC Design
1.1.1 Challenges in Semiconductor Sales Performance Under Inventory Pressure
1.1.2 Rebound in IC Design Industry is Expected
1.2 Semiconductor Manufacturing
1.2.1 Significant Drop in Wafer Fab Utilization Rate due to Chip Inventory Clearance
1.2.2 Memory Pricing and Volume Continued to Probe Bottom
1.3 IC Packaging and Testing
1.3.1 Smooth Inventory Clearance of Display Driver ICs Indicates Gradual Recovery in Demand
1.3.2 Subsequent Momentum Depends on Demand Replenishment Following Bottoming Out in 1Q

2.Outlook for the Industry
2.1 IC Design
2.1.1 Uncertainty Persists in Global Economic Recovery Pace Remains Despite Ongoing Inventory Clearance
2.1.2 Advancements in AI Computing Applications Drive Demand for Server Computing and Peripheral Chips
2.2 Semiconductor Manufacturing
2.2.1 Leading Foundries Experience Bottoming Out in 2Q, Anticipating Sequential Recovery
2.2.2 Further Decline in Server and SSD Demand to Increase Uncertainties for Memory Suppliers to Regain Momentum
2.3 IC Packaging and Testing
2.3.1 Leading Memory Suppliers Continue to Accelerate Inventory Clearance in 2H 2023
2.3.2 Emerging Trends in AI and HPC Applications Drive Development of Advanced Packaging Technologies

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