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The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

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3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moores Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan.
  

1. Worldwide 3D IC Market
 1.1 Application Sectors
 1.1.1 Consumer Electronics
 1.1.2 ICT
 1.1.3 Transportation (Automobiles and Aerospace)
 1.1.4 Military
 1.1.5 Others (Biomedical applications and R&D)
 1.2 Regional Markets
 1.2.1 North America
 1.2.2 Europe
 1.2.3 Asia Pacific
 1.2.4 Rest of the World
 1.3 Summary of the Worldwide 3D IC Market
 2. Development of Key 3D IC Component Technologies and Vendors in Taiwan
 2.1 Photolithography
 2.1.1 Overview of the Technology
 2.1.2 Supply Chain Players
 2.2 Dry Etching
 2.2.1 Overview of the Technology
 2.2.2 Supply Chain Players
 2.3 Wet Etching/Cleaning
 2.3.1 Overview of the Technology
 2.3.2 Supply Chain Players
 2.4 Coating
 2.4.1 Overview of the Technology
 2.4.2 Supply Chain Players
 2.5 Bonding
 2.5.1 Overview of the Technology
 2.5.2 Supply Chain Players
 2.6 Packaging and Testing
 2.6.1 Overview of the Technology
 2.6.2 Supply Chain Players
 2.7 Summary
 Conclusion
 Appendix
 Glossary of Terms
 List of Companies


List Of Figures

Figure 1: Worldwide 3D IC Market Value Contributed by Consumer Electronics Sector
 Figure 2: Worldwide 3D IC Market Value Contributed by ICT Sector
 Figure 3: Worldwide 3D IC Market Value Contributed by Transportation Sector
 Figure 4: Worldwide 3D IC Market Value Contributed by Military Sector
 Figure 5: Worldwide 3D IC Market Value Contributed by Other Sectors
 Figure 6: Worldwide 3D IC Market in 2012 and 2019 by Application Market
 Figure 7: Taiwanese 3D IC Equipment Supply Chain
 Figure 8: Temporary Bonding
 Figure 9: Laser De-bonding
 Figure 10: Illustration of CoWoS


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Reports Details

Published Date : Nov 2015
No. of Pages :48
Country :Taiwan
Category :Telecommunications
Publisher :Market Intelligence & Consulting Institute
Report Delivery By :Email
Report Delivery Time :12 to 24 hours after placing the order.

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