Topics Covered:

Introduction
Application Trends
Evolving Power System Architectures
Module and IC Design Trends
Module Types
Business and Manufacturing Landscape
Standards Update
Emerging Opportunities for DC-DC Converters
DC-DC Converter Module Companies
Power-Supply-On-Chip and Power-Supply-In Package Companies

Executive Summary

Although driven by obvious factors such as cost and efficiency, the real changes occurring in the dc-dc converter module and IC market are at the power architecture and advanced materials levels. The emergence of the Dynamic Bus Architecture (DBA) is, in fact, one of the most significant developments in the power supply industry in 10 years. The DBA is already being designed into some high-end systems, and widespread adoption is expected in the next few years.

System makers are demanding more efficient products in smaller footprints at what is called “cost neutrality” levels. But the broad variety of applications across many diverse industries is allowing the dc-dc converter market to thrive in both traditional and niche segments. On-board solutions are eating away at the module market, yet “the brick is not dead,” according to many power supply manufacturers.

The reason both types of products will thrive is that power architectures are evolving beyond the classic distributed power model, adapting to system makers’ need for multiple voltage rails at lower voltages. Also, newer applications such as light-emitting diodes (LEDs) and dc building power require advanced components and materials to address unique operating environments. Yet many traditional applications remain, such as industrial and transportation, that simply need proven, reliable products.

Underlying these trends are new packaging designs with increased integration. Smaller packages mean more thermal issues, and companies are looking at ways to improve efficiency while managing heat dissipation. The challenge for dc-dc converter module makers is how the Intermediate Bus Architecture is evolving: customers are demanding more efficiency, as well as configurability and optimization. This has led to a “Dynamic Bus Architecture,” which consists of board-mounted dc-dc converters or point-of-load (POL) regulators that communicate with a centralized power system host control via a digital communications bus. The firmware is partly reconfigurable to specific applications, with “energy optimization algorithms” built in.

Most of the distributed power architectures being implemented today, and certainly future systems, include some form of digital power management and control. Digital power management has become a “given” in many systems, especially computer and communications applications. “Power supply designers” are becoming “system designers,” and many of them also utilize digital control techniques when appropriate, rather than analog. The evolution of the Intermediate Bus Architecture (IBA) – from the Central Control Architecture (CCA) to the emerging Dynamic Bus Architecture (DBA) – is in part due to system demands that digital power management can address effectively.

The DBA makes use of a Digital Bus Converter (DBC), which is able to dynamically optimize its intrinsic efficiency, along with overall system efficiency, and can be controlled and monitored. In addition, the emergence of the DBC threatens to obsolete all of today’s analog bus converter products, including unregulated, semi-regulated and even regulated devices.

With global economies slowly recovering from the recession, companies are looking to keep costs low and optimize the equipment they already have. This means increasing efficiency across all application areas. Advanced materials, such as Silicon-carbide (SiC) and Gallium-nitride (GaN), are slowly becoming more cost-effective in applications with high temperature and high power requirements (SiC) or high-performance Information and Communication Technology (ICT) applications (GaN). As costs come down, these materials are likely to improve converter efficiencies and enable higher operating frequencies and smaller converter sizes.

As components and power architectures evolve, some new approaches could redefine the power supply landscape. The use of “on-chip” power supplies, for instance, includes the distribution of power in high-speed, high-complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. Intel has made gains with thin-film on-die magnetics that could speed mainstream adoption of this type of product. Power Supply on Chip (PwrSoC) is also making steady progress in the research and development area, although this technology is still several years away from commercialization.

Opportunities in the “Smart Grid” are still being defined, but most companies see smart meters as the “first step” in these applications. Some IC companies believe their product line is broad enough to encompass any smart-grid-related application, while other companies are adopting a “wait and see” attitude in terms of what will be successful.

Another trend that fits nicely with the Smart Grid concept is dc distribution in buildings, which is being embraced by utilities, where intelligent control allows communication with the utility. Dc power supports energy efficiency, “green” technologies, and building automation and control. Interest in dc building power is not new, but mainstream deployment has been elusive except in the telecommunications world. The energy demands of data centers renewed interest in dc powering, but the problems with batteries and legacy ac systems made such considerations daunting, particularly in North America and Europe.

“Dc-powered buildings” goes beyond data centers, however. The EMerge Alliance is an open industry association focused on low-voltage dc power distribution and its use in commercial interiors. In October, 2009, the EMerge Alliance released the EMerge Alliance Standard, which “establishes a more efficient means of powering the rapidly increasing number of digital, dc-powered devices, such as sensors, lighting and IT equipment.” Along with companies like Armstrong, the Alliance’s members include Delta and Tyco Electronics.

In addition, the EMerge Alliance announced the first set of 26 Registered Products in November, 2010. Already, companies like Armstrong World Industries, Cooper Industries, Finelite Inc., Lunera Lighting, Nextek Power Systems, Northwire Inc., and Tyco Electronics have products that have been registered for the EMerge Alliance Standard.

Standards are certainly driving changes in the dc-dc converter market. PMBus™ made its 2.1 specification for digital communications available to the public; the Distributed-power Open Standards Alliance (DOSA) released its non-isolated MICRO converter standard; the PCI Industrial Computer Manufacturers Group (PICMG) has proposed formal improvements to the Advanced Telecom Computing Architecture (ATCA) standard for military, defense, medical, server and scientific applications; and Power-over-Ethernet (PoE) Plus now supports up to 30W per port, and depending on the powered interface, can be configured even beyond that.

The opportunities for dc-dc converter module and IC makers are greater now than they have been in years, due to emerging applications, new power architectures, advanced materials and components, and energy efficiency standards. The power supply industry can take advantage of these developments, knowing that additional markets are likely to arise in the future.

Introduction 5
Application Trends 7
Communications 9
Computing 10
Consumer 13
Industrial & Instrumentation 14
Medical 17
Military/Aerospace 18
Evolving Power System Architectures 21
Intermediate Bus Architecture 21
Centralized Control Architecture 24
Dynamic Bus Architecture 26
Multi-core Architecture 27
Distributed On-Chip Power 29
Module and IC Design Trends 30
Integration and Packaging Trends 30
Module Packaging Trends 31
IC Packaging Trends 32
Power-Supply-on-Chip (PwrSoc) and Power-Supply-in-
Package (PSiP) 33
Other Packaging Developments 36
Materials Developments (SiC & GaN) 37
Power Density and Thermal Issues 44
Module Types 46
Bricks, Bus Converters 46
Point-of-Load (POL) Converters 48
Power Blocks 50
Business and Manufacturing Landscape 50
Standards Update 52
DC-DC Converter Module Standards 52
Distributed-power Open Standards Alliance (DOSA) 52
Point-of-Load Alliance (POLA) 53
High-Density Packaging (HDP) User Group 54
Advanced Telecommunications Computing (ATCA & MicroTCA) 55
Power-over-Ethernet (PoE) and PoE Plus 57
PMBus™ 59
Other Standards 59
Emerging Opportunities for DC-DC Converters 61
Distributed DC Power in Buildings 61
Photovoltaics 64
Light-Emitting Diodes (LEDs) 68
Competitive Overview 72
DC-DC Converter Module Companies 72
Bel Power 72
CUI Global Inc. 73
Delta Electronics 74
Ericsson Power Modules 74
FDK 74
Lineage Power 75
Martek Power 75
Murata Power Solutions 76
NetPower Technologies 76
Power-One 77
SynQor 77
TDK-Lambda 78
Vicor 79
Power-Supply-on-Chip (PwrSoc) and Power-Supply-in-Package (PSiP) Companies 80
Analog Devices 80
Enpirion 81
Infineon 81
International Rectifier 82
Linear Technology 82
Micrel 83
National Semiconductor 84
NXP Semiconductors 84
ON Semiconductor 85
STMicroelectronics 85
Texas Instruments 86

Appendix A – Report from Darnell’s Power Forum 87
Appendix B – Power-Related Standards Organizations and Members 90

List of Exhibits

Figure 1 – IBM zEnterprise 196 Mainframe 12
Figure 2 – Powertron® Railway DC-DC Converter 16
Figure 3 – Synchronous Buck Regulator for Satellite & Space
Applications 21
Figure 4 – Intermediate Bus Architecture 22
Figure 5– Centralized Control Architecture 25
Figure 6– Dynamic Bus Architecture 26
Figure 7– 2010: POL Regulators in Server Systems 28
Figure 8 – 2012-2015: POL Regulators for Servers 29
Figure 9– DC-DC Converter with Integrated Heat Sink 31
Figure 10 – Enpirion Power-System-on-Chip 35
Figure 11 – Cree Demonstrates 150mm Silicon 4-inch and 6-inch Wafers 39
Figure 12 – EPC – Small Die Should Result in Low Cost 41
Figure 13 – 600V Devices From microGaN 42
Figure 14 – LiquaCore™ Power Management Technology 45
Figure 15 – Vicor PwrSiP 1/32nd “Brick” 47
Figure 16 – Digital POL Converter 49
Figure 17 – POLA-compatible Non-isolated Power Module 54
Figure 18 – ATCA-specific Bus Converter 55
Figure 19 – PoE Midspan for High Power Terminals 58
Figure 20 – Examples of DC Power Distribution in Commercial Facilities 62
Figure 21 – DC Power Using PV as a Source 63
Figure 22 – Distributed PV Architecture Using DC-DC Solution 65
Figure 23 – National Semiconductor Solar Magic Power Optimizer, DC-DC Solution 66
Figure 24 – Tigo Energy Module Maximizer, DC-DC Solution 67
Figure 25 – 40-inch LCD TV with LED Backlighting 70
Figure 26 – High-Power DC-DC LED Driver 71